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S207/W207-Technologies for Reliability and Thermal Management

 Source : SSLChina
分会场地:Shenzhen Convention & Exhibition Center, 5th Floor, Rose Hall 2

时间安排:10-24 09:10 - 12:10

Chip junction temperature has always been an important factor limiting the function and lifetime of semiconductor devices, related thermal management technologies and reliability analysis have been involved from making a single product to managing the entire system. In the process, reliability of the whole system will be affected by advances in technologies such as novel materials for heat dissipation, thermal management technology, reliability oriented design, fault data and failure analysis, control and reliability screening in manufacturing process, accelerated life testing method, failure mode and simulation, etc..

Session Chairs

Shi-Wei. Ricky LEE——Professor at Hong Kong University of Science and Technology

Session Members

ZHAO Lixia——Professor at Institute of Semiconductors, Chinese Academy of Sciences

YANG Daoguo——Professor and the Dean at School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology

LUO Xiaobing——Professor at Huazhong University of Science and Technology

FAN Xuejun——Associate Professor at Lamar University, USA

Huai Wang——Associate Professor at Department of Energy Technology of AALBORG University

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