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技术报告

QD-MAT for Display or Lighting-Tracy 20150107 (PDF文档) 登录会员中心下载
TIM presentation 20141204_final-ppt (PDF文档) 登录会员中心下载
Failure Analysis in LED Lighting for FSLDCTR (PDF文档) 登录会员中心下载
Optical Design and manufacturing1 (PDF文档) 登录会员中心下载
高亮度发光二极管(LED)的热瞬态测量 登录会员中心下载
热管理技术体系开发与工程应用 登录会员中心下载
Two-Phase Flow Heat Transfer in Electronics Cooling with Application to LED Thermal Management April 29th 2015 登录会员中心下载
以频谱功率分布评估LED光色失效的先进故障预测技术 (PDF文档) 登录会员中心下载
功率型发光二级管(LED)的封装工艺及技术挑战 (PDF文档) 登录会员中心下载
垂直LED的特色、工艺参数、和性能比较 (PDF文档) 登录会员中心下载
LED的光度-色度学表征及相关测试标准与认证系统 (PDF文档) 登录会员中心下载
Cree Xlamp XM-L LED 逆向分析报告 (PDF文档) 登录会员中心下载
基于倒装焊无金线封装LED照明技术的整体解决方案(PDF文档) 登录会员中心下载
LED晶圆级封装与集成(PDF文档) 登录会员中心下载
Nichia NCSL119A-H1 LED逆向分析报告(预览版) (PDF文档) 登录会员中心下载
可靠性测试与失效分析 (PDF文档) 登录会员中心下载
基于纳米技术研发应用于高亮度LED的先进固晶胶水 (PDF文档) 登录会员中心下载
由固晶缺陷引起的非均匀结温的评估 (PDF文档) 登录会员中心下载

LED的热学仿真、封装材料检测及照明产品认证常见问题分析

热仿真方法助力LED的热管理(从芯片封装到应用层面) (PDF文档) 登录会员中心下载
LED控制装置CQC认证分析 (PDF文档) 登录会员中心下载
灯具认证中常见问题分析 (PDF文档) 登录会员中心下载

技术分享

3D结构的晶圆级LED封装技术(jpg文件) 登录会员中心下载
材料检测(JPG文件) 登录会员中心下载
光学测量及仿真(JPG文件) 登录会员中心下载
近似保形荧光粉涂敷技术(JPG文件) 登录会员中心下载
热管理及仿真(JPG文件) 登录会员中心下载
荧光粉印刷技术(JPG文件) 登录会员中心下载

论文下载

Design and implementation of fine pitch COB LED display (PDF文档) 登录会员中心下载
Thermal characterization of printed circuit boards (PCB) with thermal via in the application of high brightness light emitting diodes (LEDs) (PDF文档) 登录会员中心下载
Remote phosphor deposition on LED arrays with pre-encapsulated silicone lens (PDF文档) 登录会员中心下载
LED wafer level packaging with a hemispherical waffle pack remote phosphor layer (PDF文档) 登录会员中心下载
Optical characterization of a light bulb with the waffle pack LED WLP module (PDF文档) 登录会员中心下载
Quasi-conformal phosphor dispensing on LED for white light illumination (PDF文档) 登录会员中心下载
Determination of driving current of RGB LEDs for white light illumination (PDF文档) 登录会员中心下载
Effects of GaN blue LED chip and phosphor on optical performance of white light LED (PDF文档) 登录会员中心下载
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches (PDF文档) 登录会员中心下载
Effect of die attach adhesive defects on the junction temperature uniformity of LED chips (PDF文档) 登录会员中心下载
Reverse wire bonding and phosphor printing for LED wafer level packaging (PDF文档) 登录会员中心下载
LED wafer level packaging with a remote phosphor cap (PDF文档) 登录会员中心下载
Emerging trend for LED wafer level packaging (PDF文档) 登录会员中心下载
LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection (PDF文档) 登录会员中心下载
Advanced LED wafer level packaging technologies (PDF文档) 登录会员中心下载
Spacing optimization of high power LED arrays for solid state lighting (PDF文档) 登录会员中心下载
Silicon interposer with cavities and copper-filled TSVs for 3D packaging (PDF文档) 登录会员中心下载
Solid state light tube with periodic units of lateral-emitting LEDs (PDF文档) 登录会员中心下载
Solid state backlight unit with lateral-emitting LEDs and a light distributing plate (PDF文档) 登录会员中心下载
Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging (PDF文档) 登录会员中心下载
Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting (PDF文档) 登录会员中心下载
Wafer level LED packaging with integrated DRIE trenches for encapsulation (PDF文档) 登录会员中心下载
Development of surface mount compatible reel-to-reel assembly Process of LED arrays for wide area general lighting (PDF文档) 登录会员中心下载
Wafer level encapsulation process for LED array packaging (PDF文档) 登录会员中心下载
Screen-printing of yellow phosphor powder on blue light emitting diode (LED) arrays for white light illumination (PDF文档) 登录会员中心下载
Development and prototyping of a HB-LED array module for indoor solid state lighting (PDF文档) 登录会员中心下载
Process development for yellow phosphor coating on blue light emitting diodes (LEDs) for white light illumination (PDF文档) 登录会员中心下载
Lens forming by stack dispensing for LED wafer level packaging (PDF文档) 登录会员中心下载
Experimental characterization of adhesion strength between the silicone encapsulant and the bottom of a SMD LED leadframe cup (PDF文档) 登录会员中心下载
Measurement and analysis of interfacial adhesion strength between the silicone encapsulant and the side wall of a SMD LED leadframe cup (PDF文档) 登录会员中心下载